BDN13-3CB/A01 - HEATSINK CPU W/ADHESIVE 1.31SQ

Vervaardiger Deel nommer

BDN13-3CB/A01

Interne Deel nommer

AX-BDN13-3CB/A01

vervaardiger

CTS Thermal Management Products

Kort beskrywing

HEATSINK CPU W/ADHESIVE 1.31SQ

RoHS Status

Loodvrye / RoHS Compliant

Afleweringstyd

1-2 dae

beskikbare hoeveelheid

142560 Pieces

verwysingsprys

~~USD 1.968~~

Ons prys

- (Kontak ons gerus vir 'n beter prys: [email protected])

AX Semiconductor het BDN13-3CB/A01 in voorraad vir verkoop.

Gestuur opsies en gestuur tyd:: DHL: 2-3 days.; FEDEX: 2-3 days.; UPS: 2-4 days.; TNT: 3-5 days.; EMS: 5-8 days.; Normal Post: 10-15 days.

Betaal opsies:: Paypal (Credit Card); Bank Transfer (Wire Transfer); Western Union; MoneyGram

spesifikasies vir BDN13-3CB/A01

gehalte waarborg : 365 dae waarborg

Stock Resource : Franchise verspreider / Vervaardiger Direkte

Land van oorsprong : USA / TAIWAN / MEXICO / MALAYSIA / PHI

Onderdeel nommer : BDN13-3CB/A01

vervaardiger : CTS Thermal Management Products

beskrywing : HEATSINK CPU W/ADHESIVE 1.31SQ

reeks : BDN

Deelstatus : Active

tipe : Top Mount

Pakket afgekoel : Assorted (BGA, LGA, CPU, ASIC...)

Aanhegselmetode : Thermal Tape, Adhesive (Included)

vorm : Square, Pin Fins

lengte : 1.310" (33.27mm)

wydte : 1.310" (33.27mm)

deursnee : -

Hoogte buite basis (Hoogte van vin) : 0.355" (9.02mm)

Kragdissipasie @ temperatuurstyg : -

Termiese weerstand @ gedwonge lugvloei : 6.00°C/W @ 400 LFM

Termiese weerstand @ Natuurlik : 16.10°C/W

materiaal : Aluminum

Materiële afwerking : Black Anodized

gewig : -

toestand : Nuut en oorspronklik

dokumente vir BDN13-3CB/A01

Inligtingsblaaie : BDN13-3CB/A01.pdf

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