BDN16-3CB/A01 - HEATSINK CPU W/ADHESIVE 1.61SQ
Vervaardiger Deel nommer
Interne Deel nommer
vervaardiger
Kort beskrywing
HEATSINK CPU W/ADHESIVE 1.61SQ
RoHS Status
Loodvrye / RoHS Compliant
Afleweringstyd
1-2 dae
beskikbare hoeveelheid
95620 Pieces
verwysingsprys
Ons prys
- (Kontak ons gerus vir 'n beter prys: [email protected])
- AX Semiconductor het BDN16-3CB/A01 in voorraad vir verkoop.
- Gestuur opsies en gestuur tyd:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Betaal opsies:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
spesifikasies vir BDN16-3CB/A01
gehalte waarborg :
365 dae waarborg
Stock Resource :
Franchise verspreider / Vervaardiger Direkte
Land van oorsprong :
USA / TAIWAN / MEXICO / MALAYSIA / PHI
Onderdeel nommer :
BDN16-3CB/A01
vervaardiger :
CTS Thermal Management Products
beskrywing :
HEATSINK CPU W/ADHESIVE 1.61SQ
reeks :
BDN
Deelstatus :
Active
tipe :
Top Mount
Pakket afgekoel :
Assorted (BGA, LGA, CPU, ASIC...)
Aanhegselmetode :
Thermal Tape, Adhesive (Included)
vorm :
Square, Pin Fins
lengte :
1.610" (40.89mm)
wydte :
1.610" (40.89mm)
deursnee :
-
Hoogte buite basis (Hoogte van vin) :
0.355" (9.02mm)
Kragdissipasie @ temperatuurstyg :
-
Termiese weerstand @ gedwonge lugvloei :
4.50°C/W @ 400 LFM
Termiese weerstand @ Natuurlik :
13.50°C/W
materiaal :
Aluminum
Materiële afwerking :
Black Anodized
gewig :
-
toestand :
Nuut en oorspronklik
dokumente vir BDN16-3CB/A01
Inligtingsblaaie :
BDN16-3CB/A01.pdf
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